Materials Characterization and Reliability Estimation of Solder Joints in Microelectronics

Interne ID	87
Autor(en)	Michel,B., Walter,H.
Veranstaltung	EU-COST Meeting 'Lead-Free Solders'(COST-531-Action)
Ort	Lausanne, Switzerland
Datum	24.02.2005
Enddatum	27.02.2005