The microDAC deformation analysis - a new method for testing and evaluation of solder interconnect reliability

Interne ID	1
Autor(en)	Michel, B.; Dudek, R.; Vogel, D.
Veranstaltung	6th Int. Conf. On brazing, High Temperature Brazing and diffusion Bonding
Ort	Aachen, Germany
Datum	08.05.2001
Enddatum	10.05.2001