Thermomechanical Behaviour of Chipcard Materials

Interne ID	43
Autor(en)	Michel, B.; Schubert, A.; Winkler, T.
Veranstaltung	5th European Conference on Advanced Materials EuroMat '97
Ort	Maastricht, The Netherlands
Datum	21.04.1997
Enddatum	23.04.1997