Lifetime Prediction for Advanced Packaging based on Physics of Failure Approaches on a Micro and Nanoscale

Interne ID	128
Autor(en)	Wunderle,B., Dudek,R., Vogel,D., Michel,B.
Veranstaltung	Int. Symp. on Advanced Packaging Materials (APM 2006)
Ort	Atlanta, USA
Datum	15.03.2006
Enddatum	17.03.2006