Nonlinear Copper Behaviour of TSV and the Cracking Risk during BEoL Built-up for 3D-IC-Integration

Interne ID	196
Autor(en)	Auersperg,J.;Vogel,D.;Auerswald,E.;Rzepka,S.;Michel,B.
Veranstaltung	EuroSimE 2012, Internat. Conference
Ort	Lissabon, Portugal
Datum	16.04.2012
Enddatum	18.04.2012