Thermo-mechanical Reliability Analysis on Solder Joints of Ceramic Components

Interne ID	101
Autor(en)	Dudek,R., Doering,R., Michel,B., Picault,A., Autissier, J.-F.
Veranstaltung	3rd. International Conf. on Lead-free Electronics
Ort	Barcelona, Spain
Datum	08.06.2005
Enddatum	09.06.2005