Combination of Finite Element Simulation with Micro Deformation Measurements Applied to Electronic Packaging

Interne ID 32
Autor(en) Michel, B.; Kühnert, R.; Auersperg, J.; Winkler, T.
Veranstaltung Conf. MICROSIM '95
Ort Southampton, U.K
Datum 26.10.1995
Enddatum 29.10.1995