Combination of Finite Element Simulation with Micro Deformation Measurements Applied to Electronic Packaging

Interne ID	32
Autor(en)	Michel, B.; Kühnert, R.; Auersperg, J.; Winkler, T.
Veranstaltung	Conf. MICROSIM '95
Ort	Southampton, U.K
Datum	26.10.1995
Enddatum	29.10.1995