Numerical Characterization of Electronic Packaging Solutions based on Hidden Dies

Interne ID	98
Autor(en)	Sommer,J.-P., Michel, B., Ostmann, A
Veranstaltung	6th. Internat. Conf. on Electronic Packaging Technologies, invited paper
Ort	Shenzen, China
Datum	30.08.2005
Enddatum	31.08.2005