Numerical Analysis for Thermo-Mechanical Reliability of Polymeric Applications in Electronic Packaging

Interne ID	134
Autor(en)	Dudek,R.;Walter,H.; Auersperg,J.; Michel,B.
Veranstaltung	Polytronics 2007 Conf.
Ort	Tokyo, Japan
Datum	16.01.2007
Enddatum	18.01.2007