Crack and delamination Risk Evaluation of thin Silicon Based Microelectronic Devices

Interne ID	100
Autor(en)	Auersperg,J., Vogel,D., Michel,B
Veranstaltung	11th. Internat. Conf. on Fracture (ICF11)
Ort	Torino, Italy
Datum	20.03.2005
Enddatum	25.03.2005