Packaging Reliability on the Way from Micro to Nano

Interne ID	107
Autor(en)	Michel, B., Wunderle, B.
Veranstaltung	Invited Plenary Lecture, Intern. Congress Nanotechnology, ICNT 2005
Ort	San Francisco, USA
Datum	02.11.2005
Enddatum	05.11.2005