Lifetime Prediction for Advanced Packaging based on Physics of Failure Approaches on a Micro and Nanoscale

Interne ID 128
Autor(en) Wunderle,B., Dudek,R., Vogel,D., Michel,B.
Veranstaltung Int. Symp. on Advanced Packaging Materials (APM 2006)
Ort Atlanta, USA
Datum 15.03.2006
Enddatum 17.03.2006