Aspects of Chip Package Interaction and 3D Integration Assessed by the Investigation of Crack and Damage Phenomena in Low-k BEOL Stacks

Interne ID	190
Autor(en)	Auersperg, J.; Rzepka,S.; Michel, B.
Veranstaltung	2011 IEEE International Interconnect Conference (IITC)
Ort	Dresden
Datum	05.05.2011