Stress Chip Measurements of Internal Package Stresses for Process Characterization and Health Monitoring

Interne ID 195
Autor(en) Schindler-Saefkow,F.;Rost,F.;Faust,W.;Rzepka,S.;Wunderle,B.;Michel,B.
Veranstaltung EuroSimE 2012, Internat.Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems
Ort Lissabon, Portugal
Datum 16.04.2012
Enddatum 18.04.2012