Fracture toughness measurements for interaces in microelectronic packages on samples from production

Interne ID	204
Autor(en)	Maus, I.; Pape, H.; Nabi, M.; Goroll, M.; Keller, J.; Michel, B.
Veranstaltung	MSE-Materials and Engineering Congress, Symposium D, Reliability
Ort	Darmstadt
Datum	25.09.2012
Enddatum	27.09.2012