Fracture Electronics - Application of Fracture Mechanics to Microelectronic Systems and Chip Packages

Interne ID	41
Autor(en)	Michel, B.; Winkler, T.; Reichl, H.
Veranstaltung	9th International Conference on Fracture (ICF 9)
Ort	Sydney, Australia
Datum	01.04.1997
Enddatum	01.04.1997